| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | 3A001.a.7.a |
| Part Status | Obsolete |
| Family Name | LatticeXP |
| Process Technology | 130nm |
| User I/Os | 268 |
| Number of I/O Banks | 8 |
| Number of Inter Dielectric Layers | 8 |
| Operating Supply Voltage (V) | 2.5|3.3|1.8 |
| Logic Elements | 15000 |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 324 |
| Total Number of Block RAM | 36 |
| Maximum Distributed RAM Bits | 62464 |
| Device Logic Units | 15000 |
| Number of Global Clocks | 4 |
| Device Number of DLLs/PLLs | 4 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Opr. Frequency (MHz) | 320 |
| Speed Grade | 3 |
| Maximum Differential I/O Pairs | 112 |
| Minimum Operating Supply Voltage (V) | 1.71 |
| Maximum Operating Supply Voltage (V) | 3.465 |
| I/O Voltage (V) | 1.5|2.5|3.3|1.8|1.2 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tray |
| Tradename | LatticeXP |
| Standard Package Name | BGA |
| Pin Count | 388 |
| Supplier Package | FBGA |
| Mounting | Surface Mount |
| Package Height | 1.65 |
| Package Length | 23 |
| Package Width | 23 |
| PCB changed | 388 |
| Lead Shape | Ball |
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