| 欧盟限制某些有害物质的使用 | Not Compliant |
| ECCN (US) | 3A991.d |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Family Name | Fusion® |
| Process Technology | 130nm |
| User I/Os | 223 |
| Number of I/O Banks | 5 |
| Number of Inter Dielectric Layers | 7 |
| Number of Registers | 38400 |
| Operating Supply Voltage (V) | 1.5 |
| Device System Gates | 1500000 |
| Program Memory Type | Flash |
| Embedded Memory (Kbit) | 270 |
| Total Number of Block RAM | 60 |
| Device Logic Gates | 1500000 |
| Number of Global Clocks | 18 |
| Device Number of DLLs/PLLs | 2 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Opr. Frequency (MHz) | 1470.59 |
| Speed Grade | 2 |
| Maximum I/O Performance | 700Mbps |
| Minimum Operating Supply Voltage (V) | 1.425 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tray |
| Tradename | Fusion® |
| Standard Package Name | BGA |
| Pin Count | 484 |
| Supplier Package | FBGA |
| Mounting | Surface Mount |
| Package Height | 1.73 |
| Package Length | 23 |
| Package Width | 23 |
| PCB changed | 484 |
| Lead Shape | Ball |
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