| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Family Name | LatticeECP3 |
| Process Technology | 65nm |
| User I/Os | 133 |
| Number of I/O Banks | 7 |
| Operating Supply Voltage (V) | 1.2 |
| Logic Elements | 33000 |
| Number of Multipliers | 64 (18x18) |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 1327 |
| Total Number of Block RAM | 72 |
| Maximum Distributed RAM Bits | 69632 |
| SERDES Channels | 4 |
| Device Logic Units | 33000 |
| Number of Global Clocks | 16 |
| Device Number of DLLs/PLLs | 4+2 |
| Dedicated DSP | 32 |
| Programmability | Yes |
| Reprogrammability Support | No |
| Copy Protection | No |
| In-System Programmability | No |
| Speed Grade | 6 |
| Maximum I/O Performance | 3.2Gbps |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Maximum Operating Supply Voltage (V) | 1.26 |
| I/O Voltage (V) | 2.5|1.5|3.3|1.8|1.2 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 100 |
| Supplier Temperature Grade | Industrial |
| Packaging | Tray |
| Tradename | LatticeEC |
| Standard Package Name | BGA |
| Pin Count | 256 |
| Supplier Package | FTBGA |
| Mounting | Surface Mount |
| Package Height | 1.25(Max) |
| Package Length | 17 |
| Package Width | 17 |
| PCB changed | 256 |
| Lead Shape | Ball |
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