| 欧盟限制某些有害物质的使用 | Not Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| Type | High Speed Amplifier |
| Manufacturer Type | High Speed Amplifier |
| Number of Channels per Chip | 1 |
| Process Technology | BiCOM |
| Maximum Input Offset Voltage (mV) | 0.3@±15V |
| Minimum Dual Supply Voltage (V) | ±2.5 |
| Typical Dual Supply Voltage (V) | ±3|±12|±15|±5|±9 |
| Maximum Dual Supply Voltage (V) | ±18 |
| Maximum Input Offset Current (uA) | 0.3@±15V |
| Maximum Input Bias Current (uA) | 0.3@±15V |
| Maximum Supply Current (mA) | 10.5@±15V |
| Typical Output Current (mA) | 26@±15V |
| Power Supply Type | Dual |
| Typical Slew Rate (V/us) | 200@±15V |
| Typical Input Noise Voltage Density (nV/rtHz) | 3@±15V |
| Typical Voltage Gain (dB) | 106.02 |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 2@±15V |
| Minimum PSRR (dB) | 98 |
| Minimum CMRR (dB) | 100 |
| Minimum CMRR Range (dB) | 95 to 105 |
| Typical Gain Bandwidth Product (MHz) | 500 |
| Typical Settling Time (ns) | 120 |
| Shut Down Support | No |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Standard Package Name | DIP |
| Pin Count | 8 |
| Supplier Package | CDIP N |
| Mounting | Through Hole |
| Package Height | 3.56(Max) |
| Package Length | 10.29(Max) |
| Package Width | 7.87(Max) |
| PCB changed | 8 |
| Lead Shape | Through Hole |
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