欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
Type | Low Power Amplifier |
Manufacturer Type | Low Power Amplifier |
Number of Channels per Chip | 2 |
Rail to Rail | Rail to Rail Input/Output |
Process Technology | CMOS |
Output Type | CMOS |
Maximum Input Offset Voltage (mV) | 3@5V |
Minimum Single Supply Voltage (V) | 1.8 |
Typical Single Supply Voltage (V) | 5|3 |
Maximum Single Supply Voltage (V) | 5.5 |
Minimum Dual Supply Voltage (V) | ±0.9 |
Maximum Dual Supply Voltage (V) | ±2.75 |
Maximum Input Offset Current (uA) | 0.00001(Typ)@5.5V |
Typical Input Bias Current (uA) | 0.00001@5.5V |
Maximum Quiescent Current (mA) | 1.15@5V |
Power Supply Type | Dual|Single |
Typical Slew Rate (V/us) | 6@5.5V |
Typical Input Noise Voltage Density (nV/rtHz) | 12@5V |
Typical Voltage Gain (dB) | 104 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.0013@5V |
Minimum PSRR (dB) | 90.46(Typ) |
Minimum CMRR (dB) | 72 |
Minimum CMRR Range (dB) | 71 to 75 |
Typical Gain Bandwidth Product (MHz) | 10 |
Typical Settling Time (ns) | 1000 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Temperature Grade | Extended |
Packaging | Tape and Reel |
Standard Package Name | SOP |
Pin Count | 8 |
Supplier Package | SOIC |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Length | 5(Max) |
Package Width | 3.98(Max) |
PCB changed | 8 |
Lead Shape | Gull-wing |