| 欧盟限制某些有害物质的使用 | Not Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.33.00.01 |
| Type | High Speed Amplifier |
| Manufacturer Type | High Speed Amplifier |
| Number of Channels per Chip | 1 |
| Process Technology | BiCOM |
| Maximum Input Offset Voltage (mV) | 1@±5V |
| Minimum Dual Supply Voltage (V) | ±4.5 |
| Typical Dual Supply Voltage (V) | ±15|±12|±5|±9 |
| Maximum Dual Supply Voltage (V) | ±18 |
| Maximum Input Offset Current (uA) | 0.3@±5V |
| Maximum Input Bias Current (uA) | 5@±5V |
| Power Supply Type | Dual |
| Maximum Power Dissipation (mW) | 1100 |
| Typical Slew Rate (V/us) | 200@±5V |
| Typical Input Noise Voltage Density (nV/rtHz) | 15@±15V |
| Typical Voltage Gain (dB) | 70.88 |
| Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@±15V |
| Minimum PSRR (dB) | 75 |
| Minimum CMRR (dB) | 80 |
| Minimum CMRR Range (dB) | 80 to 85 |
| Typical Gain Bandwidth Product (MHz) | 35 |
| Typical Settling Time (ns) | 140 |
| Shut Down Support | No |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Packaging | Tube |
| Standard Package Name | DIP |
| Pin Count | 8 |
| Supplier Package | CDIP |
| Mounting | Through Hole |
| Package Height | 3.56(Max) |
| Package Length | 10.29(Max) |
| Package Width | 7.87(Max) |
| PCB changed | 8 |
| Lead Shape | Through Hole |
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