| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | AUP |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Channels per Chip | 1 |
| Number of Inputs per Chip | 1 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 1 |
| Number of Output Enables per Chip | 1 Low |
| Bus Hold | No |
| Polarity | Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 21.6@1.1V to 1.3V|9.5@1.65V to 1.95V|6.4@3V to 3.6V|12.3@1.4V to 1.6V|7.1@2.3V to 2.7V |
| Absolute Propagation Delay Time (ns) | 29.5 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 4 |
| Maximum High Level Output Current (mA) | -4 |
| Minimum Operating Supply Voltage (V) | 0.8 |
| Typical Operating Supply Voltage (V) | 2.5|1.8|3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Maximum Quiescent Current (uA) | 0.5 |
| Propagation Delay Test Condition (pF) | 30 |
| Maximum Power Dissipation (mW) | 250 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Pin Count | 5 |
| Supplier Package | X2SON EP |
| Mounting | Surface Mount |
| Package Height | 0.31(Max) |
| Package Length | 0.8 |
| Package Width | 0.8 |
| PCB changed | 5 |
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