| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | LVC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 2 |
| Number of Inputs per Chip | 2 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 2 |
| Number of Output Enables per Chip | 1 Low/1 High |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 2.8(Typ)@2.7V|2.6(Typ)@3V to 3.6V|2.1(Typ)@4.5V to 5.5V |
| Absolute Propagation Delay Time (ns) | 15.2 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 32 |
| Maximum High Level Output Current (mA) | -32 |
| Minimum Operating Supply Voltage (V) | 1.65 |
| Typical Operating Supply Voltage (V) | 5|1.8|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Tolerant I/Os (V) | 5 |
| Typical Quiescent Current (uA) | 0.1 |
| Maximum Quiescent Current (uA) | 40 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 300 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Pin Count | 8 |
| Supplier Package | TSSOP |
| Mounting | Surface Mount |
| Package Height | 0.95(Max) |
| Package Length | 3.1(Max) |
| Package Width | 3.1(Max) |
| PCB changed | 8 |
种类齐全 一站购物
正品保障 源头可溯
极速物流 在线跟踪
优质服务 省心省时
客服企业微信
