| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 8 |
| Number of Inputs per Chip | 8 |
| Number of Input Enables per Chip | 0 |
| Number of Outputs per Chip | 8 |
| Number of Output Enables per Chip | 2 Low |
| Bus Hold | No |
| Polarity | Non-Inverting |
| Maximum Propagation Delay Time @ Maximum CL (ns) | 15@6V|96@2V|50@3V|18@4.5V |
| Absolute Propagation Delay Time (ns) | 165 |
| Process Technology | CMOS |
| Input Signal Type | Single-Ended |
| Output Type | 3-State |
| Maximum Low Level Output Current (mA) | 7.8 |
| Maximum High Level Output Current (mA) | -7.8 |
| Minimum Operating Supply Voltage (V) | 2 |
| Typical Operating Supply Voltage (V) | 5|2.5|3.3 |
| Maximum Operating Supply Voltage (V) | 6 |
| Maximum Quiescent Current (uA) | 4 |
| Propagation Delay Test Condition (pF) | 50 |
| Maximum Power Dissipation (mW) | 500 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tape and Reel |
| Standard Package Name | SOP |
| Pin Count | 20 |
| Supplier Package | SOIC W |
| Mounting | Surface Mount |
| Package Height | 2.4(Max) |
| Package Length | 12.95(Max) |
| Package Width | 7.6(Max) |
| PCB changed | 20 |
| Lead Shape | Gull-wing |
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