欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
Type | High Output Current Amplifier |
Manufacturer Type | High Output Current Amplifier |
Number of Channels per Chip | 2 |
Rail to Rail | Rail to Rail Output |
Process Technology | XFCB-HV |
Maximum Input Offset Voltage (mV) | 2.4@5V |
Minimum Single Supply Voltage (V) | 3 |
Typical Single Supply Voltage (V) | 5|9|18|12|24|15 |
Maximum Single Supply Voltage (V) | 25.2 |
Minimum Dual Supply Voltage (V) | ±1.5 |
Typical Dual Supply Voltage (V) | ±3|±12|±5|±9 |
Maximum Dual Supply Voltage (V) | ±12.6 |
Maximum Input Offset Current (uA) | 0.3@5V |
Maximum Input Bias Current (uA) | 0.9@5V |
Maximum Supply Current (mA) | 24@5V |
Typical Output Current (mA) | 230@5V |
Power Supply Type | Dual|Single |
Typical Slew Rate (V/us) | 53@5V |
Typical Input Noise Voltage Density (nV/rtHz) | 4.5@5V |
Typical Voltage Gain (dB) | 90 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 1.5@5V |
Minimum PSRR (dB) | 75 |
Minimum CMRR (dB) | 76 |
Minimum CMRR Range (dB) | 75 to 80 |
Typical Gain Bandwidth Product (MHz) | 35 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Packaging | Tube |
Standard Package Name | SOP |
Pin Count | 8 |
Supplier Package | SOIC N EP |
Mounting | Surface Mount |
Package Height | 1.65 |
Package Length | 4.9 |
Package Width | 3.9 |
PCB changed | 8 |
Lead Shape | Gull-wing |