欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
Type | Low Power Amplifier |
Manufacturer Type | Low Power Amplifier |
Number of Channels per Chip | 4 |
Rail to Rail | Rail to Rail Input/Output |
Process Technology | CMOS |
Output Type | CMOS |
Maximum Input Offset Voltage (mV) | 3.5@2.4V |
Minimum Single Supply Voltage (V) | 1.8 |
Typical Single Supply Voltage (V) | 3 |
Maximum Single Supply Voltage (V) | 3.6 |
Minimum Dual Supply Voltage (V) | ±0.8 |
Maximum Dual Supply Voltage (V) | ±1.8 |
Maximum Input Offset Current (uA) | 0.000015@2.4V |
Maximum Input Bias Current (uA) | 0.000015@2.4V |
Maximum Supply Current (mA) | 0.112@3.6V |
Typical Output Current (mA) | 10.2@2.4V |
Power Supply Type | Dual|Single |
Maximum Power Dissipation (mW) | 1600 |
Typical Slew Rate (V/us) | 0.23@3.6V |
Typical Input Noise Voltage Density (nV/rtHz) | 95@2.4V |
Typical Voltage Gain (dB) | 101.58 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.0008@2.4V |
Minimum CMRR (dB) | 63 |
Minimum CMRR Range (dB) | 60 to 65 |
Typical Gain Bandwidth Product (MHz) | 0.5 |
Typical Settling Time (ns) | 13900 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Packaging | Tube |
Standard Package Name | DIP |
Pin Count | 14 |
Supplier Package | PDIP |
Mounting | Through Hole |
Package Height | 5.08(Max) - 0.51(Min) |
Package Length | 19.69(Max) |
Package Width | 6.6(Max) |
PCB changed | 14 |
Lead Shape | Through Hole |