| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Type | SPI|I2C |
| Automotive | Yes |
| Number of Channels per Chip | 6 |
| Maximum Data Rate | 10Mbps |
| Maximum Rise Time (ns) | 250 |
| Maximum Fall Time (ns) | 250 |
| Output Type | Logic |
| Minimum Operating Supply Voltage (V) | 3 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Minimum Isolation Voltage (Vrms) | 4200 |
| Maximum Propagation Delay Time (tPHL) (ns) | 350 |
| Maximum Working Insulation Voltage | 850Vp |
| Maximum Propagation Delay Time (tPLH) (ns) | 350 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Packaging | Tray |
| Minimum Common Mode Rejection (kV/us) | 50 |
| Maximum ESD Protection Voltage (kV) | ±15@HBM |
| Supplier Temperature Grade | Automotive |
| Coupling Type | Magnetic Coupling |
| Standard Package Name | BGA |
| Pin Count | 24 |
| Supplier Package | BGA |
| Mounting | Surface Mount |
| Package Height | 2.41 |
| Package Length | 9 |
| Package Width | 6.25 |
| PCB changed | 24 |
| Lead Shape | Ball |
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