欧盟限制某些有害物质的使用 | Not Compliant |
ECCN (US) | 3A001.a.7.a |
Part Status | Active |
HTS | 8542.39.00.01 |
Family Name | ProASIC®3 |
User I/Os | 300 |
Process Technology | 130nm |
Number of I/O Banks | 4 |
Number of Inter Dielectric Layers | 7 |
Number of Registers | 24576 |
Operating Supply Voltage (V) | 1.5 |
Device System Gates | 1000000 |
Program Memory Type | Flash |
Embedded Memory (Kbit) | 144 |
Total Number of Block RAM | 32 |
Device Logic Gates | 1000000 |
Number of Global Clocks | 18 |
Device Number of DLLs/PLLs | 1 |
Maximum Supply Current (mA) | 75 |
JTAG Support | Yes |
Programmability | Yes |
Reprogrammability Support | Yes |
Copy Protection | No |
Opr. Frequency (MHz) | 231 |
In-System Programmability | Yes |
Speed Grade | STD |
Differential I/O Standards | LVDS|M-LVDS|B-LVDS|LVPECL |
Single-Ended I/O Standards | LVCMOS|LVTTL |
Maximum Differential I/O Pairs | 74 |
Maximum I/O Performance | 700Mbps |
Minimum Operating Supply Voltage (V) | 1.425 |
Maximum Operating Supply Voltage (V) | 1.575 |
I/O Voltage (V) | 3.3|1.5|1.8|2.5 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Packaging | Tray |
Tradename | ProASIC |
Standard Package Name | BGA |
Pin Count | 484 |
Supplier Package | FBGA |
Mounting | Surface Mount |
Package Height | 1.73 |
Package Length | 23 |
Package Width | 23 |
PCB changed | 484 |
Lead Shape | Ball |