| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.39.00.01 |
| Family Name | IGLOO |
| User I/Os | 133 |
| Process Technology | 130nm |
| Number of I/O Banks | 2 |
| Number of Inter Dielectric Layers | 7 |
| Number of Registers | 3072 |
| Operating Supply Voltage (V) | 1.5|1.2 |
| Device System Gates | 125000 |
| Program Memory Type | Flash |
| Embedded Memory (Kbit) | 36 |
| Total Number of Block RAM | 8 |
| Device Logic Gates | 125000 |
| Number of Global Clocks | 18 |
| Device Number of DLLs/PLLs | 1 |
| JTAG Support | Yes |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Speed Grade | STD |
| Single-Ended I/O Standards | LVCMOS|LVTTL |
| Maximum I/O Performance | 700Mbps |
| Minimum Operating Supply Voltage (V) | 1.14 |
| Maximum Operating Supply Voltage (V) | 1.575 |
| I/O Voltage (V) | 3.3|1.5|1.8|2.5|1.2 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Industrial |
| Packaging | Box |
| Tradename | IGLOO |
| Standard Package Name | BGA |
| Pin Count | 196 |
| Supplier Package | CSP |
| Mounting | Surface Mount |
| Package Height | 0.7 |
| Package Length | 8 |
| Package Width | 8 |
| PCB changed | 196 |
| Lead Shape | Ball |
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