欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.39.00.01 |
Family Name | LatticeXP2 |
User I/Os | 172 |
Process Technology | 90nm |
Number of I/O Banks | 8 |
Operating Supply Voltage (V) | 1.2 |
Shift Registers | Utilize LUT |
Logic Elements | 5000 |
Number of Multipliers | 12 (18x18) |
Program Memory Type | SRAM |
Embedded Memory (Kbit) | 166 |
Total Number of Block RAM | 9 |
Maximum Distributed RAM Bits | 10240 |
Device Logic Units | 5000 |
Number of Global Clocks | 8 |
Device Number of DLLs/PLLs | 2 |
JTAG Support | Yes |
Dedicated DSP | 3 |
Programmability | No |
Reprogrammability Support | Yes |
Number of Look-up Table Input | 4 |
Copy Protection | No |
In-System Programmability | No |
Speed Grade | 5 |
GMACs | 3.9 |
Mega Multiply Accumulates per second | 3900 |
Differential I/O Standards | LVCMOS |
Maximum Differential I/O Pairs | 66 |
Minimum Operating Supply Voltage (V) | 1.14 |
Maximum Operating Supply Voltage (V) | 1.26 |
I/O Voltage (V) | 1.8|1.2|3.3|2.5|1.5 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Commercial |
Tradename | LatticeXP |
Standard Package Name | BGA |
Pin Count | 256 |
Supplier Package | FTBGA |
Mounting | Surface Mount |
Package Height | 1.25(Max) |
Package Length | 17 |
Package Width | 17 |
PCB changed | 256 |
Lead Shape | Ball |