欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | 3A001.a.7.b |
Part Status | Active |
HTS | 8542.39.00.01 |
Family Name | Fusion® |
User I/Os | 119 |
Process Technology | 130nm |
Number of I/O Banks | 5 |
Number of Inter Dielectric Layers | 7 |
Number of Registers | 13824 |
Operating Supply Voltage (V) | 1.5 |
Device System Gates | 600000 |
Program Memory Type | Flash |
Embedded Memory (Kbit) | 108 |
Total Number of Block RAM | 24 |
Device Logic Gates | 600000 |
Number of Global Clocks | 18 |
Device Number of DLLs/PLLs | 2 |
Programmability | Yes |
Reprogrammability Support | Yes |
Copy Protection | No |
Opr. Frequency (MHz) | 1470.59 |
In-System Programmability | Yes |
Speed Grade | 2 |
Maximum I/O Performance | 700Mbps |
Minimum Operating Supply Voltage (V) | 1.425 |
Maximum Operating Supply Voltage (V) | 1.575 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Packaging | Tray |
Tradename | Fusion® |
Standard Package Name | BGA |
Pin Count | 256 |
Supplier Package | FBGA |
Mounting | Surface Mount |
Package Height | 1.2 |
Package Length | 17 |
Package Width | 17 |
PCB changed | 256 |
Lead Shape | Ball |