| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.24 |
| DRAM Type | SDRAM |
| Chip Density (bit) | 256M |
| Organization | 8Mx32 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 2M |
| Number of Bits/Word (bit) | 32 |
| Data Bus Width (bit) | 32 |
| Maximum Clock Rate (MHz) | 133 |
| Maximum Access Time (ns) | 6|5.4 |
| Address Bus Width (bit) | 12 |
| Interface Type | LVTTL |
| Minimum Operating Supply Voltage (V) | 2.7 |
| Typical Operating Supply Voltage (V) | 3.3 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Operating Current (mA) | 140 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 32 |
| Standard Package Name | BGA |
| Pin Count | 90 |
| Supplier Package | TFBGA |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Length | 13 |
| Package Width | 8 |
| PCB changed | 90 |
| Lead Shape | Ball |
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