| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.32.00.71 |
| DRAM Type | RLDRAM3 |
| Chip Density (bit) | 576M |
| Organization | 32Mx18 |
| Number of Internal Banks | 16 |
| Number of Words per Bank | 2M |
| Number of Bits/Word (bit) | 18 |
| Data Bus Width (bit) | 18 |
| Maximum Clock Rate (MHz) | 1600 |
| Address Bus Width (bit) | 24 |
| Minimum Operating Supply Voltage (V) | 1.28 |
| Typical Operating Supply Voltage (V) | 1.35 |
| Maximum Operating Supply Voltage (V) | 1.42 |
| Operating Current (mA) | 1400 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 95 |
| Supplier Temperature Grade | Commercial |
| Number of I/O Lines (bit) | 18 |
| Standard Package Name | BGA |
| Pin Count | 168 |
| Supplier Package | FBGA |
| Mounting | Surface Mount |
| Package Height | 0.68(Min) |
| Package Length | 13.5 |
| Package Width | 13.5 |
| PCB changed | 168 |
| Lead Shape | Ball |
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