| 欧盟限制某些有害物质的使用 | Not Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.51 |
| Cell Type | NOR |
| Chip Density (bit) | 16M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Asymmetrical |
| Location of Boot Block | Bottom |
| Address Bus Width (bit) | 19 |
| Sector Size | 64Kbyte x 30|8Kbyte x 16 |
| Bank Size | 4/12Mb |
| Number of Banks | 2 |
| Number of Bits/Word (bit) | 32 |
| Number of Words | 512K |
| Programmability | Yes |
| Timing Type | Synchronous|Asynchronous |
| Max. Access Time (ns) | 54 |
| Maximum Erase Time (s) | 230/Chip |
| Maximum Programming Time (ms) | 120000/Chip |
| OE Access Time (ns) | 20 |
| Process Technology | 110nm, CMOS |
| Interface Type | Parallel|Serial |
| Minimum Operating Supply Voltage (V) | 2.5 |
| Typical Operating Supply Voltage (V) | 2.6 |
| Maximum Operating Supply Voltage (V) | 2.75 |
| Programming Voltage (V) | 2.5 to 2.75 |
| Operating Current (mA) | 55 |
| Program Current (mA) | 50 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 125 |
| Supplier Temperature Grade | Extended |
| Command Compatible | Yes |
| ECC Support | No |
| Support of Page Mode | No |
| Packaging | Tray |
| Standard Package Name | BGA |
| Pin Count | 80 |
| Supplier Package | Fortified BGA |
| Mounting | Surface Mount |
| Package Height | 0.6(Min) |
| Package Length | 13 |
| Package Width | 11 |
| PCB changed | 80 |
| Lead Shape | Ball |
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