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W29GL128CH9C

供应商型号:W29GL128CH9C

含税单价8.7600

品      牌Winbond Electronics 期货周期20 星期

参数 NOR Flash Parallel 3V/3.3V 128M-bit 128M x 1 100ns 56-Pin TFBGA
数据表 W29GL128CH9C PDF资料
现货批次 1635+
数量
+-
库存:171
交期7-10工作日
递增 起订1       递增倍数1
阶梯价格(人民币含税)
  • 1-10件¥8.76
  • 10-25件¥8.62
  • 25-50件¥8.48
  • 50-100件¥8.34
  • 100件以上¥8.20
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欧盟限制某些有害物质的使用 Compliant
ECCN (US) 3A991.b.1.a
Part Status Obsolete
HTS 8542.32.00.71
Cell Type NOR
Chip Density (bit) 128M
Architecture Sectored
Boot Block Yes
Block Organization Symmetrical
Location of Boot Block Top|Bottom
Address Bus Width (bit) 23
Sector Size 128Kbyte x 128
Page Size 256byte
Number of Bits/Word (bit) 1
Number of Words 128M
Programmability Yes
Timing Type Asynchronous
Max. Access Time (ns) 100
Maximum Erase Time (s) 256/Chip
Maximum Page Access Time (ns) 35
Maximum Programming Time (ms) 224000/Chip
OE Access Time (ns) 35
Interface Type Parallel
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 55
Page Read Current (mA) 25
Program Current (mA) 30
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode Yes
Minimum Endurance (Cycles) 100000
Standard Package Name BGA
Pin Count 56
Supplier Package TFBGA
Mounting Surface Mount
Package Height 0.85(Max)
Package Length 9
Package Width 7
PCB changed 56
Lead Shape Ball
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