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N25Q032A13E1240E

供应商型号:N25Q032A13E1240E

含税单价10.5400

品      牌Micron Technology 期货周期110 星期

参数 NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 32M-bit 32M/16M/8M x 1/2-bit/4-bit 7ns 24-Pin TBGA Tray
数据表 N25Q032A13E1240E PDF资料
现货批次 1851+
数量
+-
库存:7714
交期7-10工作日
递增 起订1       递增倍数1
阶梯价格(人民币含税)
  • 1-1000件¥10.54
  • 1000-2500件¥8.46
  • 2500-5000件¥7.51
  • 5000件以上¥7.27
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欧盟限制某些有害物质的使用 Compliant
ECCN (US) 3A991.b.1.a
Part Status Obsolete
HTS 8542.32.00.71
Cell Type NOR
Chip Density (bit) 32M
Architecture Sectored
Boot Block Yes
Block Organization Symmetrical
Location of Boot Block Top|Bottom
Address Bus Width (bit) 22
Sector Size 64Kbyte x 64
Page Size 256byte
Number of Bits/Word (bit) 1/2/4
Number of Words 32M/16M/8M
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 7
Maximum Erase Time (s) 3/Sector
Maximum Programming Time (ms) 5/Page
Process Technology 65nm
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Frequency (MHz) 108
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6|8.5 to 9.5
Operating Current (mA) 20
Program Current (mA) 20
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support No
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Packaging Tray
Standard Package Name BGA
Pin Count 24
Supplier Package TBGA
Mounting Surface Mount
Package Height 0.79
Package Length 8
Package Width 6
PCB changed 24
Lead Shape Ball
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