欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | 3A991.B.1.A |
Part Status | LTB |
HTS | 8542.32.00.71 |
Cell Type | NOR |
Chip Density (bit) | 64M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Asymmetrical |
Location of Boot Block | Top |
Address Bus Width (bit) | 23/22 |
Sector Size | 8Kbyte x 8|64Kbyte x 127 |
Page Size | 8Words/16byte |
Number of Bits/Word (bit) | 8/16 |
Number of Words | 8M/4M |
Programmability | Yes |
Timing Type | Asynchronous |
Max. Access Time (ns) | 90 |
Maximum Erase Time (s) | 128/Chip |
Maximum Page Access Time (ns) | 25 |
Maximum Programming Time (ms) | 63000(Typ)/Chip |
OE Access Time (ns) | 25 |
Process Technology | 110nm, MirrorBit |
Interface Type | Parallel |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 50 |
Page Read Current (mA) | 20 |
Program Current (mA) | 60 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Command Compatible | Yes |
ECC Support | No |
Support of Page Mode | Yes |
Minimum Endurance (Cycles) | 100000 |
Packaging | Tray |
Standard Package Name | BGA |
Pin Count | 48 |
Supplier Package | FBGA |
Mounting | Surface Mount |
Package Height | 0.76(Max) |
Package Length | 8.15 |
Package Width | 6.15 |
PCB changed | 48 |
Lead Shape | Ball |