| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | 3A991.B.1.A |
| Part Status | Active |
| HTS | 8542.32.00.71 |
| Cell Type | NOR |
| Chip Density (bit) | 256M |
| Architecture | Sectored |
| Boot Block | Yes |
| Block Organization | Symmetrical |
| Location of Boot Block | Top|Bottom |
| Address Bus Width (bit) | 18 |
| Sector Size | 64Kbyte x 512 |
| Number of Bits/Word (bit) | 8 |
| Number of Words | 32M |
| Programmability | Yes |
| Timing Type | Synchronous |
| Max. Access Time (ns) | 96 |
| Maximum Erase Time (s) | 231/Chip |
| Maximum Programming Time (ms) | 1.26/Word |
| Process Technology | 65nm |
| Interface Type | Hyper |
| Minimum Operating Supply Voltage (V) | 1.7 |
| Typical Operating Supply Voltage (V) | 1.8 |
| Maximum Operating Supply Voltage (V) | 1.95 |
| Programming Voltage (V) | 1.7 to 1.95 |
| Operating Current (mA) | 180 |
| Program Current (mA) | 100 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Automotive |
| Command Compatible | Yes |
| ECC Support | Yes |
| Support of Page Mode | Yes |
| Minimum Endurance (Cycles) | 100000 |
| Packaging | Tray |
| Standard Package Name | BGA |
| Pin Count | 24 |
| Supplier Package | Fortified BGA |
| Mounting | Surface Mount |
| Package Height | 1(Max) - 0.2(Min) |
| Package Length | 8 |
| Package Width | 6 |
| PCB changed | 24 |
| Lead Shape | Ball |
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