欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.33.00.01 |
Type | High Speed Amplifier |
Manufacturer Type | High Speed Amplifier |
Number of Channels per Chip | 4 |
Process Technology | BiFET |
Maximum Input Offset Voltage (mV) | 2.5@±15V |
Minimum Dual Supply Voltage (V) | ±4 |
Typical Dual Supply Voltage (V) | ±9|±18|±5|±12|±15 |
Maximum Dual Supply Voltage (V) | ±20 |
Maximum Input Offset Current (uA) | 0.00005@±15V |
Maximum Input Bias Current (uA) | 0.0001@±15V |
Maximum Quiescent Current (mA) | 11.2@±15V |
Power Supply Type | Dual |
Typical Slew Rate (V/us) | 13@±15V |
Typical Input Noise Voltage Density (nV/rtHz) | 26@±15V |
Typical Voltage Gain (dB) | 109.54 |
Typical Noninverting Input Current Noise Density (pA/rtHz) | 0.0018@±15V |
Minimum PSRR (dB) | 86 |
Minimum CMRR (dB) | 80 |
Minimum CMRR Range (dB) | 80 to 85 |
Typical Gain Bandwidth Product (MHz) | 5 |
Typical Settling Time (ns) | 1300 |
Shut Down Support | No |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 70 |
Supplier Temperature Grade | Commercial |
Packaging | Tape and Reel |
Standard Package Name | SOP |
Pin Count | 16 |
Supplier Package | SOIC W |
Mounting | Surface Mount |
Package Height | 2.34(Max) |
Package Length | 10.49(Max) |
Package Width | 7.6(Max) |
PCB changed | 16 |
Lead Shape | Gull-wing |