欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8541.29.00.95 |
Typical Gate Threshold Voltage (V) | 0.83 |
Maximum Pulsed Drain Current @ TC=25°C (A) | 24 |
Typical Gate Plateau Voltage (V) | 1.5 |
Typical Diode Forward Voltage (V) | 0.69 |
Maximum Positive Gate Source Voltage (V) | 12 |
Maximum Diode Forward Voltage (V) | 1.2 |
产品类别 | Power MOSFET |
Process Technology | PowerTrench |
Configuration | Single Quad Drain |
Channel Mode | Enhancement |
Channel Type | N |
Number of Elements per Chip | 1 |
Maximum Drain Source Voltage (V) | 20 |
Maximum Gate Source Voltage (V) | ±12 |
Maximum Gate Threshold Voltage (V) | 1.5 |
Operating Junction Temperature (°C) | -55 to 150 |
Maximum Continuous Drain Current (A) | 5.7 |
Maximum Gate Source Leakage Current (nA) | 10000 |
Maximum IDSS (uA) | 1 |
Maximum Drain Source Resistance (mOhm) | 30@4.5V |
Typical Gate Charge @ Vgs (nC) | 8.8@4.5V |
Typical Gate to Drain Charge (nC) | 2.4 |
Typical Gate to Source Charge (nC) | 0.9 |
Typical Input Capacitance @ Vds (pF) | 701@10V |
Typical Reverse Transfer Capacitance @ Vds (pF) | 125@10V |
Minimum Gate Threshold Voltage (V) | 0.6 |
Typical Output Capacitance (pF) | 163 |
Maximum Power Dissipation (mW) | 2400 |
Typical Fall Time (ns) | 8.6 |
Typical Rise Time (ns) | 8.6 |
Typical Turn-Off Delay Time (ns) | 21.5 |
Typical Turn-On Delay Time (ns) | 9.8 |
Minimum Operating Temperature (°C) | -55 |
Maximum Operating Temperature (°C) | 150 |
Packaging | Tape and Reel |
Automotive | No |
Standard Package Name | DFN |
Pin Count | 6 |
Supplier Package | WDFN EP |
Military | No |
Mounting | Surface Mount |
Package Height | 0.75 |
Package Length | 2 |
Package Width | 2 |
PCB changed | 6 |
Lead Shape | No Lead |