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S25FL256SAGBHI310

供应商型号:S25FL256SAGBHI310

含税单价24.8700

品      牌Cypress Semiconductor 期货周期52 星期

参数 NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 14.5ns 24-Pin BGA Tray
数据表 S25FL256SAGBHI310 PDF资料

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阶梯价格(人民币含税)
  • 338-500件¥24.87
  • 500件以上¥24.20
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欧盟限制某些有害物质的使用 Compliant
ECCN (US) 3A991.B.1.A
Part Status Active
Cell Type NOR
Chip Density (bit) 256M
Architecture Sectored
Boot Block Yes
Block Organization Symmetrical
Location of Boot Block Top|Bottom
Address Bus Width (bit) 32
Sector Size 256Kbyte x 128
Page Size 512byte|256byte
Number of Bits/Word (bit) 1/2/4
Number of Words 256M/128M/64M
Programmability Yes
Timing Type Synchronous
Max. Access Time (ns) 14.5
Maximum Erase Time (s) 330/Bulk
Maximum Programming Time (ms) 0.75/Page
Process Technology 65nm, MirrorBit
Interface Type Serial (SPI, Dual SPI, Quad SPI)
Maximum Operating Frequency (MHz) 133
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3|3.3
Maximum Operating Supply Voltage (V) 3.6
Programming Voltage (V) 2.7 to 3.6
Operating Current (mA) 100
Program Current (mA) 100
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Command Compatible Yes
ECC Support Yes
Support of Page Mode No
Minimum Endurance (Cycles) 100000
Packaging Tray
Standard Package Name BGA
Pin Count 24
Supplier Package BGA
Mounting Surface Mount
Package Height 1.2(Max) - 0.25(Min)
Package Length 8
Package Width 6
PCB changed 24
Lead Shape Ball
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