欧盟限制某些有害物质的使用 | Compliant |
ECCN (US) | 3A991.B.1.A |
Part Status | Active |
HTS | 8542.32.00.71 |
Cell Type | NOR |
Chip Density (bit) | 512M |
Architecture | Sectored |
Boot Block | Yes |
Block Organization | Symmetrical |
Location of Boot Block | Top|Bottom |
Address Bus Width (bit) | 32 |
Sector Size | 256Kbyte x 256 |
Page Size | 512byte |
Number of Bits/Word (bit) | 1/2/4 |
Number of Words | 512M/256M/128M |
Programmability | Yes |
Timing Type | Synchronous |
Max. Access Time (ns) | 14.5 |
Maximum Erase Time (s) | 460/Bulk |
Maximum Programming Time (ms) | 0.75/Page |
Process Technology | 65nm, MirrorBit |
Interface Type | Serial (SPI, Dual SPI, Quad SPI) |
Maximum Operating Frequency (MHz) | 133 |
Minimum Operating Supply Voltage (V) | 2.7 |
Typical Operating Supply Voltage (V) | 3|3.3 |
Maximum Operating Supply Voltage (V) | 3.6 |
Programming Voltage (V) | 2.7 to 3.6 |
Operating Current (mA) | 100 |
Program Current (mA) | 100 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 85 |
Supplier Temperature Grade | Industrial |
Command Compatible | Yes |
ECC Support | Yes |
Support of Page Mode | No |
Minimum Endurance (Cycles) | 100000 |
Packaging | Tape and Reel |
Standard Package Name | SOP |
Pin Count | 16 |
Supplier Package | SOIC W |
Mounting | Surface Mount |
Package Height | 2.55(Max) |
Package Length | 10.3 |
Package Width | 7.5 |
PCB changed | 16 |
Lead Shape | Gull-wing |